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US 10,121,723 B1Granted
Semiconductor component and method for producing a semiconductor component
AssigneeInfineon Technologies Austria AG
InventorsKok Tee Lau, Jayaganasan Narayanasamy
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Abstract
According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The first thermally conductive layer formed on the outer surface of the semiconductor package is configured to be mounted to an external heat sink.
Claims21
A method comprising:
- forming a first thermally conductive layer on an outer surface of a semiconductor package, wherein forming the first thermally conductive layer comprises:
- depositing a first material on the outer surface of the semiconductor package;
- and
- depositing a second material on the first material after depositing the first material, wherein depositing the second material on the first material comprises at least one of an electrophoretic deposition process, an e-coating process, a dispensing method, an electrostatic spraying method or a dipping method.
1 more element
A semiconductor component, comprising:
- a semiconductor package with an outer surface;
- and
- a first thermally conductive layer arranged on the outer surface of the semiconductor package,
- wherein the first thermally conductive layer comprises a first material comprising a porous pre-layer disposed on the outer surface of the semiconductor package and a second material disposed over first material.
1 more element
Dependencies are inferred from the claim text.