Architecture material and process to improve thermal performance of the embedded die package

A method of forming a device package, comprising:

• disposing a package layer on a substrate, wherein the package layer includes a mold layer surrounding a first plurality of solder balls and a die;
• disposing a trench in the mold layer to surround the die of the package layer;
• and
• disposing a conductive layer on a top surface of the die, wherein the conductive layer is disposed over the top surface of the die and in the trench of the package layer.

A device package, comprising:

• a package layer disposed on a substrate, wherein the package layer includes a mold layer surrounding a first plurality of solder balls and a die;
• a trench disposed in the mold layer to surround the die of the package layer;
• a conductive layer disposed on a top surface of the die, wherein the conductive layer is disposed over the top surface of the die and in the trench of the package layer;
• an interposer with a second plurality of solder balls disposed on the conductive layer and above the package layer;
• an underfill layer disposed between a bottom surface of the interposer and a top surface of the package layer;
• and
• a memory with a third plurality of solder balls disposed on the interposer, wherein the third solder balls electrically couple the memory and the interposer, and wherein a fourth plurality of solder balls are disposed on a bottom surface of the substrate.