Heat dissipation bump electrode for chip on film

A semiconductor package, comprising:

• a semiconductor chip carrying a bump electrode formed thereon and including a semiconductor substrate and at least one electrode layer;
• a wiring substrate carrying a lead line connected to said bump electrode, the lead line being formed on a facing surface of the wiring substrate facing the semiconductor chip;
• at least one heat dissipation bump electrode for dissipating heat disposed on the semiconductor chip, a surface of said semiconductor substrate and said electrode layer being connected to each other through a metallic material at a location directly below said heat dissipation bump electrode within the surface of said semiconductor substrate;
• and
• at least one heat dissipation pattern formed on said facing surface of the wiring substrate and being electrically connected to said heat dissipation bump electrode, to dissipate heat from the semiconductor chip, wherein
• the heat dissipation bump electrode is formed over or around a high temperature area on the semiconductor chip, the high temperature area having a temperature higher than a predetermined threshold value during operation of the semiconductor chip.