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US 10,121,720 B2Granted
Semiconductor device, corresponding apparatus and method
AssigneeSTMicroelectronics S.r.l.
InventorFederico Giovanni Ziglioli
Life of this patent
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Abstract
A semiconductor device, such as a semiconductor power device, includes: a semiconductor die having a semiconductor die front surface, a package formed onto the semiconductor die, the package having a portion facing the front surface of the semiconductor die, and a thermally-conductive layer including graphene over the front portion of the package facing the front surface of the semiconductor die.
Claims19
A semiconductor device, comprising:
- a semiconductor die having a surface;
- a conductive member having first and second ends;
- a package material formed on the semiconductor die, the package material having a top surface, the first end of the conductive member being on the top surface of the package material, wherein the second end is outside of the package material;
- and
- a thermally-conductive layer contacting the top surface of the package material and the first end of the conductive member, the thermally-conductive layer facing the surface of the semiconductor die, the thermally-conductive layer including graphene.
2 more elements
An apparatus, comprising:
- a support substrate;
- and at least one semiconductor package including:
- a semiconductor die;
- a molding compound covering at least a portion of the semiconductor die;
- a conductive member having a first end on a top surface of the molding compound and a second end configured to be coupled to another device outside of the molding compound;
- and a thermally-conductive layer contacting the molding compound and the first end of the conductive member, the thermally-conductive layer including graphene.
3 more elements
A method comprising:
- forming a semiconductor package that includes a package material that encapsulates at least partially a semiconductor die, the semiconductor package including a conductive member having a first end on a top surface of the package material and a second end arranged laterally with respect to the package material and outside of the package material;
- and forming a thermally-conductive layer including graphene contacting the top surface of the package material and the first end of the conductive member.
Dependencies are inferred from the claim text.