Semiconductor device

A semiconductor device comprising:

• a heatsink;
• an insulating substrate disposed above said heatsink;
• a semiconductor element disposed above said insulating substrate;
• a case made of resin, said case enclosing an upper-surface side of said heatsink, said insulating substrate, and said semiconductor element;
• and
• an electrode including a portion within an inner region defined by said case, said electrode being electrically connected to said semiconductor element at one surface of said portion through a wire,
• wherein another surface of said portion of said electrode within said inner region defined by said case is an uneven surface having a predetermined pattern that includes an annular protrusion or recess, linear two-way protrusions or recesses that intersect with each other, or protrusions or recesses that have vertexes and are triangular in a side view, and
• wherein at said uneven surface, a resin portion is provided, said resin portion extending from an inner wall of said case to said upper-surface side of said heatsink and having an uneven portion fitted in said uneven surface.

A semiconductor device comprising:

• an insulating substrate whose lower part has a heat dissipation portion;
• a semiconductor element disposed above said insulating substrate;
• a case made of resin, said case enclosing an upper-surface side of said insulating substrate and said semiconductor element;
• and
• an electrode including a portion within an inner region defined by said case, said electrode being electrically connected to said semiconductor element at one surface of said portion through a wire,
• wherein in said portion of said electrode within said inner region defined by said case, at another surface with respect to a position in which said wire is connected, a resin portion is provided, said resin portion extending from an inner wall of said case to said upper-surface side of said insulating substrate and from an end of said electrode within said inner region defined by said case towards said inner wall of said case, and
• wherein in said portion of said electrode within said inner region defined by said case, at another surface with respect to a position in which said wire is not connected, a heat conductor is provided in direct contact with said electrode, said heat conductor having higher thermal conductivity than said resin portion.

A semiconductor device comprising:

• an insulating substrate whose lower part has a heat dissipation portion;
• a semiconductor element disposed above said insulating substrate;
• a case made of resin, said case enclosing an upper-surface side of said insulating substrate and said semiconductor element;
• and
• an electrode including a portion within an inner region defined by said case, said electrode being electrically connected to said semiconductor element at one surface of said portion through a wire,
• wherein another surface of said portion of said electrode within said inner region defined by said case is an uneven surface having a predetermined pattern that includes an annular protrusion or recess, linear two-way protrusions or recesses that intersect with each other, or protrusions or recesses that have vertexes and are triangular in a side view, and
• wherein at said uneven surface, a resin portion is provided, said resin portion extending from an inner wall of said case to said upper-surface side of said insulating substrate and having an uneven portion fitted in said uneven surface.