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US 10,121,715 B2Granted
Jig for fabricating semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorYo Sakamoto
Life of this patent
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Abstract
A semiconductor device fabrication method, including preparing a case having a plurality of connection terminals, and fitting a jig onto the case to protect the connection terminals, tips of the connection terminals protruding from the jig. The method further includes fitting a printed circuit board on the tips of the connection terminals protruding from the jig.
Claims6
A jig for fabricating a semiconductor device that includes
- a case housing a semiconductor element, and
- connection terminals, formed on the case, that are electrically connected to main electrodes of the semiconductor element,
- the jig comprising:
- a first plate portion and a second plate portion, one of the first and second plate portions having a plurality of holding portions formed therein, and
- a fixing portion fixing the first and second plate portions, so that the connection terminals are held in and protected by the holding portions, tips of the connection terminals being protrusible from the jig.
2 more elements
A semiconductor device, comprising
- a case housing a semiconductor element that has a plurality of main electrodes;
- a plurality of connection terminals, formed on the case and electrically connected to the main electrodes of the semiconductor element;
- a printed circuit board electrically connected to the connection terminals, the printed circuit board being formed using a jig that holds the connection terminals and being thus formed on tips of the connection terminals protruding from the jig;
- and
- a plurality of guide pins disposed on peripheral edge portions of the case.
2 more elements
Dependencies are inferred from the claim text.