Virtual metrology systems and methods for using feedforward critical dimension data to predict other critical dimensions of a wafer

Abstract

A controller includes a memory that stores a first model corresponding to a first critical dimension of a substrate processed by a substrate processing system and a second model corresponding to a second critical dimension of the substrate. The second model includes a predicted relationship between the first critical dimension and the second critical dimension. A critical dimension prediction module calculates a first prediction of the first critical dimension of the substrate using the first model, provides the first prediction of the first critical dimension as an input to the second model, and calculates and outputs a second prediction of the second critical dimension of the substrate using the second model.

Dependencies are inferred from the claim text.