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US 10,121,701 B2Granted
Substrate conductor structure and method
AssigneeIntel Corporation
InventorsHarold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow, Mark Hlad
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Abstract
Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.
Claims10
A method of forming a semiconductor device, comprising:
- ablating core material to form a first non-cylindrical hole in the core material, the first non-cylindrical hole comprising a first substantially elongated slot with rounded ends;
- situating first conductor material on walls of the first non-cylindrical hole;
- using a flash plate step to increase a thickness of the first conductor material on the walls of the first non-cylindrical hole;
- filling a void between the walls lined with the first conductor material with a plugging resin;
- ablating the plugging resin to form a second non-cylindrical hole all the way through the resin, the second non-cylindrical hole contained within the first non-cylindrical hole, the second non-cylindrical hole comprising a second substantially elongated slot with rounded ends;
- situating second conductor material on walls of the plugging resin and the second non-cylindrical hole;
- using a flash plate step to increase a thickness of the second conductor material on the walls of the second non-cylindrical hole;
- and bridging the second conductor material on the walls of the second non-cylindrical hole to fill the second non-cylindrical hole with conductor material.
5 more elements
Dependencies are inferred from the claim text.