Manufacturing method, pickup method, equipment and EMI (electromagnetic interference) electromagnetic shielding layer manufacturing method of SiP (system in package) module

A EMI electromagnetic shielding layer manufacturing method of the SiP module, and comprises the following steps:

• the SiP module is fixedly arranged on the upper surface of the carrier with the through hole through the doubled-sided adhesive tape, the lower surface of the SiP module is a surface, which is provided with the welding pads, and the welding pads are right above the through hole and do not touch the doubled-sided adhesive tape;
• conductive material is sputtered around and on the upper surface of the SIP module to form an EMI electromagnetic shielding layer;
• the nozzle descends to touch the upper surface of the SIP module, and sucks the SiP module;
• the air thimble ascends to touch the lower surface of the carrier;
• the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble;
• compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened;
• the nozzle ascends to pick up the manufactured SiP module with EMI electromagnetic shielding layers on the upper surface and around and without pollution or damage on the lower surface.

A manufacturing method of the SIP module, and the method comprises the following steps:

• chips, active components and passive components required for the SiP module are welded on the upper surface of a PCB (printed circuit board), welding pads are pre-reserved on the lower surface of the PCB, and the PCBA (printed circuit board assembly) of the SiP module is manufactured;
• molding compound is filled in the PCBA, so that the molding compound covers the chips, active components and passive components on the upper surface of the PCBA, the molding compound is solidified and the SiP module is manufactured;
• the SiP module is fixedly arranged on the upper surface of the carrier with the through hole through the doubled-sided adhesive tape, the lower surface of the SiP module is a surface, which is provided with the welding pads, and the welding pads are right above the through hole and do not touch the doubled-sided adhesive tape;
• conductive material is sputtered around and on the upper surface of the SiP module to form an EMI electromagnetic shielding layer;
• the nozzle descends to touch the upper surface of the SiP module, and sucks the SiP module;
• the air thimble ascends to touch the lower surface of the carrier;
• the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble;
• compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened;
• the nozzle ascends to pick up the manufactured SiP module without pollution or damage on the lower surface.