Semiconductor processing device

A semiconductor processing apparatus, comprising:

• a micro chamber configured to accommodate and process a semiconductor wafer, the micro chamber comprising an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface, the upper chamber portion and the lower chamber portion being relatively movable along a primary moving direction between an open position for loading and removing the semiconductor wafer and a closed position for accommodating the semiconductor wafer,
• wherein, when the upper chamber portion or the lower chamber portion is in the closed position, the micro chamber is configured to allow the semiconductor wafer to be disposed between, and substantially sealed by, the upper working surface and the lower working surface,
• wherein an inner wall of the micro chamber comprises gaps thereon, the gaps configured to allow a fluid to flow therein,
• wherein at least one of the upper chamber portion or the lower chamber portion comprises at least one inlet and at least one outlet, the at least one inlet configured to allow the fluid to enter the micro chamber, the at least one outlet configured to discharge the fluid out of the micro chamber,
• wherein the lower chamber portion comprises a lower chamber plate, a lower box device and an insert component, the lower chamber plate defining the lower working surface,
• wherein the lower box device comprises an uncovered cavity having a top opening and a side opening, the uncovered cavity comprising a bottom surface substantially perpendicular to the primary moving direction and a plurality of side walls surrounding the bottom surface except for the side opening that opens toward a direction that is substantially perpendicular to the primary moving direction, each of the plurality of side walls having a recessed groove for receiving a respective edge of the lower chamber plate, the recessed groove substantially perpendicular to the primary moving direction, and
• wherein the lower chamber plate is fixedly disposed to the lower box device with the recessed groove of each of the plurality of side walls receiving the respective edge of the lower chamber plate, and with the insert component inserted into the side opening, such that the top opening of the uncovered cavity is substantially closed by the lower chamber plate.