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US 10,121,649 B2Granted
Cleaning method of semiconductor wafer
AssigneeSiltronic AG
InventorTeruo Haibara
Life of this patent
Estimating the term…
Abstract
A wax removal method uniformly removes wax adhering to a wafer surface and reduces the problems of re-adhesion of particles and filter clogging of a cleaning bath during cleaning. The method uses cleaning liquid which contains microbubbles.
Claims10
A cleaning method of removing wax which is adhered to a semiconductor wafer surface, by using a cleaning liquid, the cleaning method comprising:
- introducing a gas to the cleaning liquid by using a microbubble generating device in order to generate microbubbles in the cleaning liquid, and immersing a semiconductor wafer in the cleaning liquid which contains the microbubbles generated by the gas to clean a surface of the semiconductor wafer, wherein wax adhering to the surface of the semiconductor wafer is uniformly removed while dissolving the wax in the cleaning liquid without exfoliating the wax as a solid material,
- wherein the cleaning liquid is an aqueous liquid containing an alkaline component and a surfactant component, wherein the alkaline component is quaternary ammonium hydroxide, and wherein surfactant component is limited to surfactants selected from the group consisting of tetraalkylammonium salts, alkylpyridinium salts, and amine salts.
A cleaning method of removing wax which is adhered to a semiconductor wafer surface, by using a cleaning liquid, the cleaning method comprising:
- introducing a gas to the cleaning liquid by using a microbubble generating device in order to generate microbubbles in the cleaning liquid, and immersing a semiconductor wafer in the cleaning liquid which contains the microbubbles generated by the gas to clean a surface of the semiconductor wafer, wherein wax adhering to the surface of the semiconductor wafer is uniformly removed while dissolving the wax in the cleaning liquid without exfoliating the wax as a solid material;
- wherein the cleaning liquid comprises an alkaline component and a surfactant component wherein the surfactant component is limited to surfactants selected from the group consisting of tetraalkylammonium salts, alkylpyridinium salts, and amine salts and wherein the alkaline component comprises at least one tetraalkylammonium hydroxide.
Dependencies are inferred from the claim text.