Multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• a laminated body including:
• a plurality of laminated dielectric layers and a plurality of laminated internal electrodes;
• a first principal surface and a second principal surface opposite to one another in a laminating direction;
• a first side surface and a second side surface opposite to one another in a width direction perpendicular to the laminating direction;
• and
• a first end surface and a second end surface opposite to one another in a length direction perpendicular to the laminating direction and the width direction;
• a first external electrode connected to the plurality of laminated internal electrodes, and disposed on the first end surface, with an end extending on the first principal surface, the second principal surface, the first side surface, and the second side surface;
• a second external electrode connected to the plurality of laminated internal electrodes, and disposed on the second end surface, with an end extending on the first principal surface, the second principal surface, the first side surface, and the second side surface;
• wherein
• the first external electrode includes a first base electrode layer including a conductive metal and a glass component, a first organic layer including an organic silicon compound, disposed to cover the first base electrode layer, and a first plating layer disposed on the first organic layer;
• the second external electrode includes a second base electrode layer including a conductive metal and a glass component, a second organic layer including an organic silicon compound, disposed to cover the second base electrode layer, and a second plating layer disposed on the second organic layer;
• the first organic layer is disposed to cover from the first base electrode layer to at least a portion of a surface of the laminated body, and the second organic layer is disposed to cover from the second base electrode layer to at least a portion of a surface of the laminated body;
• a leading end of the first plating layer is in contact with the first organic layer, and a leading end of the second plating layer is in contact with the second organic layer;
• and
• when the first organic layer disposed on the first base electrode layer located on the first principal surface or the second principal surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer of a principal surface portion, and the first organic layer disposed on the first base electrode layer located on the first end surface or the second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer of an end surface portion, a surface roughness of the organic layer of the end surface portion is larger than a surface roughness of the organic layer of the principal surface portion.