Gluing device, gluing method and colloid for packaging devices
AssigneesBoe Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
InventorsWei Quan, Chiahao Chang, Chinlung Liao
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AssigneesBoe Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
InventorsWei Quan, Chiahao Chang, Chinlung Liao
Estimating the term…
The present disclosure provides a gluing device, a gluing method and a colloid for packaging devices. The gluing device includes an instillation head configured to guide a glue added with magnetic material in an instillation direction; and a magnetic field generation mechanism configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material through the magnetic field in a direction identical to or opposite to the instillation direction. Thus a flow rate of the glue in the instillation direction is controlled through the force applied by the magnetic material to the glue. The glue in the gluing device may be smoothly dripped out at a constant flow rate, thereby to prevent the occurrence of discontinuous or thin glue lines in the related art due to an insufficient pressure during gluing.
A gluing device comprising:
A gluing method comprising:
A gluing device comprising:
Dependencies are inferred from the claim text.