Resistor and method for manufacturing resistor

A resistor comprising:

• a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate;
• metal terminals electrically joined to the metal electrodes;
• and
• an Al member formed on second surface side of the ceramic substrate,
• wherein the ceramic substrate and the Al member are joined to each other using an Al—Si-based brazing filler metal,
• the metal electrodes and the metal terminals are joined to each other using a solder, and
• a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of −30 μm/50 mm to 700 μm/50 mm,
• wherein a thickness of the ceramic substrate is in a range of 0.3 mm to 1.0 mm,
• wherein a thickness of the Al member is in a range of 3.0 mm to 10.0 mm, and
• wherein a thickness of the metal electrodes is in a range of 2 μm or more and 3 μm or less.