Apparatus, method and system for providing termination for multiple chips of an integrated circuit package
AssigneeIntel Corporation
InventorsGeorge Vergis, Kuljit S. Bains, James A. McCall, Ge Chang
Life of this patent
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AssigneeIntel Corporation
InventorsGeorge Vergis, Kuljit S. Bains, James A. McCall, Ge Chang
Estimating the term…
Techniques and mechanisms for providing termination for a plurality of chips of a memory device. In an embodiment, a memory device is an integrated circuit (IC) package which includes a command and address bus and a plurality of memory chips each coupled thereto. Of the plurality of memory chips, only a first memory chip is operable to selectively provide termination to the command and address bus. Of the respective on-die termination control circuits of the plurality of memory chips, only the on-die termination control circuit of the first memory chip is coupled via any termination control signal line to any input/output (I/O) contact of the IC package. In another embodiment, the plurality of memory chips are configured in a series with one another, and wherein the first memory chip is located at an end of the series.
An integrated circuit (IC) package comprising:
A system comprising:
Dependencies are inferred from the claim text.