Printed circuit board assembly with image sensor mounted thereon
AssigneeSunASIC Technologies, Inc.
InventorsChi-Chou Lin, Zheng-Ping He
Life of this patent
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Abstract
A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.
Claims12
A printed circuit board assembly (PCBA), comprising:
- a printed circuit board (PCB), comprising:
- a first insulation layer, having a first opening formed therein;
- a second insulation layer, having a second opening formed therein;
- a first electrically conductive layer, forming a first specific circuit on a partial top surface of the first insulation layer;
- a second electrically conductive layer, forming a second specific circuit and a plurality of connectors between the first insulation layer and the second insulation layer;
- and
- a third electrically conductive layer, forming a third specific circuit on a partial bottom surface of the second insulation layer,
- wherein the second opening is smaller than the first opening and formed beneath the first opening;
- a platform is formed on a top surface of the second insulation layer enclosed by peripherals of the first opening;
- the plurality of connectors are formed on the platform;
- an image sensing chip, having a plurality of bonding pads with a sensor portion facing down through the second opening, and fixed on the platform with each bonding pad connected to one corresponding connector;
- and
- a protection layer formed over some portions of the top surface of the first insulation layer, the first electrically conductive layer and a whole bottom surface of the image sensing chip opposite to the sensor portion for providing resistance when a force is exerted on the sensor portion,
- wherein the first insulation layer and the whole bottom surface of the image sensing chip together form a flat surface for the protection layer to be formed thereon;
- and
- wherein a non-conductive adhesive is applied in gaps between the sensor portion and the second opening while the sensor portion has a size smaller than the second opening or applied along peripheral of the sensor portion while the sensor portion has a size the same as the second opening to form a fixture to provide tension when a finger exerts force on the sensor portion of the image sensing chip.
Dependencies are inferred from the claim text.