Single-chip control module for an integrated system-on-a-chip for silicon photonics

A method of using an integrated single-chip device in a system-on-a-chip configured in a communication network, the method comprising:

• providing a silicon photonics device in a first die, the silicon photonics device comprising at least a laser device, a modulator, a photo detector, and an optical mux/demux device;
• providing an integrated single-chip device in a second die, the integrated single-chip module comprising:
• a silicon substrate member;
• a data input/output interface provided on the silicon substrate member and configured for a predefined data rate and protocol;
• an input/output block provided on the silicon substrate member and coupled to the data input/output interface, the input/output block comprising a transmitting block for a very-short-reach (VSR) network host and a receiving block for the VSR host;
• a signal processing block provided on the silicon substrate member and coupled to the input/output block using a bi-direction bus in an intermediary protocol;
• a driver module provided on the silicon substrate member and coupled to the signal processing block using a uni-directional multi-lane bus;
• a driver interface provided on the silicon substrate member and coupled to the driver module and configured to couple to a silicon photonics device, the driver interface being configured to transmit output data in an amplitude modulation format;
• a receiver module provided on the silicon substrate member, and configured to couple to the signal processing block to communicate information to the input/output block for transmission through the data input/output interface;
• a communication block provided on the silicon substrate member and operably coupled to the input/output block, the signal processing block, the driver module, and the receiver module for multiple series communications;
• and
• a communication interface coupled to the communication block;
• disposing the first die and the second die on a same substrate to form a communication system-on-a-chip, the driver interface and the receiver module in the integrated single-chip device in the first die being coupled to the silicon photonics device in the second die using a predefined modulation format to receive information converted from optical signals;
• transferring signals from the integrated single-chip device to the silicon photonics device and to the network.

A network system comprising an integrated single-chip device coupled with a silicon photonics device for controlling optoelectronic signals communication in a network, the integrated single-chip device comprising:

• a silicon substrate member;
• a data input/output interface provided on the silicon substrate member and configured for a predefined data rate and protocol;
• an input/output block provided on the silicon substrate member and coupled to the data input/output interface, the input/output block comprising a transmitting block for a very-short-reach (VSR) network host and a receiving block for the VSR host;
• a signal processing block provided on the silicon substrate member and coupled to the input/output block using a bi-direction bus in an intermediary protocol;
• a driver module provided on the silicon substrate member and coupled to the signal processing block using a uni-directional multi-lane bus;
• a driver interface provided on the silicon substrate member and coupled to the driver module and configured to be coupled to the silicon photonics device, the driver interface being configured to transmit output data in an amplitude modulation format;
• a receiver module provided on the silicon substrate member and configured to couple to the silicon photonics device using predefined modulation format to receive information converted from optical signals and couple to the signal processing block to communicate information to the input/output block for transmission through the data input/output interface;
• a communication block provided on the silicon substrate member and operably coupled to the input/output block, the signal processing block, the driver module, and the receiver module for multiple series communications;
• and
• a communication interface coupled to the communication block;
• and
• the silicon photonics device comprising at least a laser device, a modulator, a photo detector, and an optical mux/demux device, the silicon photonics device being formed in a separate die coupled to the silicon substrate member.