Thermal management apparatus and method using dynamic thermal margin, and semiconductor processor device, non-volatile data storage device and access control method using the same

A thermal management apparatus, comprising:

• a thermal margin determination unit configured to determine a thermal margin of a semiconductor processor device based on any one of a priority of threads being executed on one or more processor cores of the semiconductor processor device and a load of the one or more processor cores;
• a thermal margin state determination unit configured to determine a thermal margin state of the semiconductor processor device based on a current temperature of the semiconductor processor device and the thermal margin;
• and
• a policy determination unit configured to determine a thermal management policy regarding the one or more processor cores based on the thermal margin state,
• wherein the thermal margin defines a difference between a critical temperature of the semiconductor processor device, which is a temperature adapted to protect the semiconductor processor device, and a restrictive temperature of the semiconductor processor device, which is a temperature adapted to cause a change in the thermal management policy, and
• wherein the thermal margin state is determined to be a state in which the current temperature of the semiconductor processor device is lower than the restrictive temperature or a state in which the current temperature is not lower than the restrictive temperature.

A thermal management method for a semiconductor processor device comprising one or more processor cores, comprising:

• determining a thermal margin of the semiconductor processor device based on any one of a priority of threads being executed on the one or more processor cores and a load of the one or more processor cores;
• determining a thermal margin state of the semiconductor processor device based on a current temperature of the semiconductor processor device and the thermal margin;
• and
• determining a thermal management policy regarding the processor cores based on the thermal margin state,
• wherein the thermal margin defines a difference between a critical temperature of the semiconductor processor device, which is a temperature adapted to protect the semiconductor processor device, and a restrictive temperature of the semiconductor processor device, which is a temperature adapted to cause a change in the thermal management policy, and
• wherein the thermal margin state is determined to be a state in which the current temperature is lower than the restrictive temperature or a state in which the current temperature is not lower than the restrictive temperature.

A non-volatile data storage device, comprising:

• one or more non-volatile memory modules;
• an I/O queue reception unit configured to receive I/O queues including I/O commands regarding one or more logical storage spaces from one or more hosts;
• a thermal margin determination unit configured to determine a thermal margin of the one or more non-volatile memory modules for the I/O queues based on any one or any combination of any two or more of a priority assigned to the I/O queues, a type of I/O commands, and a length of the I/O queues;
• a thermal margin state determination unit configured to determine thermal margin states of the one or more non-volatile memory modules for the I/O queues based on the thermal margin and a current temperature of a non-volatile memory module on which the I/O queues are selected to be executed from among the one or more non-volatile memory modules;
• an execution sequence arbitration unit configured to arbitrate an execution sequence of the I/O commands constituting the I/O queues based on the thermal margin states, which are of the respective I/O queues;
• and
• an I/O command execution unit configured to execute the I/O commands based on the arbitrated execution sequence,
• wherein the thermal margin defines a difference between a critical temperature adapted to protect the one or more non-volatile memory modules and a restrictive temperature adapted to cause switching of the thermal margin state, and
• wherein the thermal margin state is determined to be a normal state, in which the current temperature is lower than the restrictive temperature, or a restriction state, in which the current temperature is higher than the restrictive temperature.

A thermal management apparatus for a non-volatile data storage device including one or more non-volatile memory modules, an I/O queue reception unit configured to receive I/O queues including I/O commands regarding one or more logical storage spaces from one or more hosts, an execution sequence arbitration unit configured to arbitrate an execution sequence based on a burst size in connection with the I/O commands constituting the I/O queues, and an I/O command execution unit configured to execute the I/O commands according to the arbitrated execution sequence, the thermal management apparatus comprising:

• a thermal margin determination unit configured to determine thermal margins of the one or more non-volatile memory modules for the I/O queues based on any one or any combination of any two or more of a priority assigned to the I/O queues, a type of I/O commands, and a length of the I/O queues;
• a thermal margin state determination unit configured to determine thermal margin states of the one or more non-volatile memory modules for the I/O queues based on the thermal margins and a current temperature of a non-volatile memory module on which the I/O queues are selected to be executed from among the one or more non-volatile memory modules;
• and
• a dynamic performance control unit configured to maintain or extend a burst size for I/O commands belonging to an I/O queue, among the I/O queues, having a thermal margin state, among the thermal margin states, of a normal state, and to reduce a burst size for I/O commands belonging to an I/O queue, among the I/O queues, having the a thermal margin state, among the thermal margin states, of a restriction state,
• wherein the thermal margins define a difference between a critical temperature adapted to protect the one or more non-volatile memory modules and a restrictive temperature adapted to cause switching of the thermal margin states, and
• wherein a thermal margin state, among the thermal margin states, is determined to be the normal state, in which the current temperature is lower than the restrictive temperature, or the restriction state, in which the current temperature is higher than the restrictive temperature.

A thermal management apparatus for a non-volatile data storage device including one or more non-volatile memory modules, an I/O queue reception unit configured to receive I/O queues including I/O commands regarding one or more logical storage spaces from one or more hosts, an execution sequence arbitration unit configured to arbitrate an execution sequence based on a priority in connection with the I/O commands constituting the I/O queues, and an I/O command execution unit configured to execute the I/O commands according to the arbitrated execution sequence, the thermal management apparatus comprising:

• a thermal margin determination unit configured to determine thermal margins of the one or more non-volatile memory modules for the I/O queues based on at least one of a priority assigned to the I/O queues, a type of I/O commands, and a length of the I/O queues;
• a thermal margin state determination unit configured to determine thermal margin states of the one or more non-volatile memory modules for the I/O queues based on the thermal margins and a current temperature of a non-volatile memory module on which the I/O queues are selected to be executed from among the one or more non-volatile memory modules;
• and
• a dynamic performance control unit configured to maintain or extend a burst size for I/O commands belonging to an I/O queue, among the I/O queues, having a thermal margin state, among the thermal margin states, of a normal state, and to reduce a burst size for I/O commands belonging to an I/O queue, among the I/O queues, having a thermal margin state, among the thermal margin states, of a restriction state,
• wherein the thermal margins define a difference between a critical temperature adapted to protect the one or more non-volatile memory modules and a restrictive temperature adapted to cause switching of the thermal margin states, and
• wherein a thermal margin state, among the thermal margin states, is determined to be a normal state, in which the current temperature is lower than the restrictive temperature, or a restriction state, in which the current temperature is higher than the restrictive temperature.

A data access control method for a non-volatile data storage device comprising one or more non-volatile memory modules, the data access control method comprising:

• receiving one or more I/O queues comprising I/O commands regarding one or more logical storage spaces from one or more hosts;
• determining a thermal margin of the one or more non-volatile memory modules for an I/O queue, among the I/O queues, based on any one or any combination of any two or more of a priority assigned to the I/O queues, a type of I/O commands, and a length of the I/O queues;
• determining a thermal margin state of the one or more non-volatile memory modules for the I/O queue based on a current temperature of the one or more non-volatile memory modules and the thermal margin, which is of a non-volatile memory module on which the I/O queues are selected to be executed from among the non-volatile memory modules;
• arbitrating an execution sequence in connection with the I/O commands which constitute the I/O queues based on the thermal margin state;
• and
• executing the I/O commands according to the arbitrated execution sequence,
• wherein the thermal margin defines a difference between a critical temperature adapted to protect the non-volatile memory modules and a restrictive temperature adapted to cause switching of the thermal margin state, and
• wherein the thermal margin state is determined to be a normal state in which the current temperature is lower than the restrictive temperature or a restriction state in which the current temperature is higher than the restrictive temperature.

A thermal management method for a non-volatile data storage device including one or more non-volatile memory modules, an I/O queue reception unit configured to receive one or more I/O queues including I/O commands regarding one or more logical storage spaces from one or more hosts, an execution sequence arbitration unit configured to arbitrate an execution sequence based on a burst size in connection with the I/O commands constituting the I/O queues, and an I/O command execution unit configured to execute the I/O commands according to the arbitrated execution sequence, the thermal management method comprising:

• determining a thermal margin of the one or more non-volatile memories for an I/O queue, among the I/O queues, based on at least one of a priority assigned to the I/O queues, a type of I/O commands, and a length of the I/O queues;
• determining a thermal margin state of the one or more non-volatile memories for the I/O queue based on the thermal margin and a current temperature of a non-volatile memory module on which the I/O queues are selected to be executed from among the non-volatile memory modules;
• and
• determining a burst size by maintaining or extending a burst size for I/O commands belonging to an I/O queue, among the I/O queues, having the thermal margin state of a normal state, and reducing a burst size for I/O commands belonging to an I/O queue, among the I/O queues, having the thermal margin state of a restriction state,
• wherein the thermal margin defines a difference between a critical temperature adapted to protect the non-volatile memory modules and a restrictive temperature adapted to cause switching of the thermal margin state, and
• wherein the thermal margin state is determined to be the normal state, in which the current temperature is lower than the restrictive temperature, or the restriction state, in which the current temperature is higher than the restrictive temperature.

A thermal management method for a non-volatile data storage device including one or more non-volatile memory modules, an I/O queue reception unit configured to receive one or more I/O queues including I/O commands regarding one or more logical storage spaces from one or more hosts, an execution sequence arbitration unit configured to arbitrate an execution sequence based on a burst size in connection with the I/O commands constituting the I/O queues, and an I/O command execution unit configured to execute the I/O commands according to the arbitrated execution sequence, the thermal management method comprising:

• determining thermal margins of the one or more non-volatile memory modules for the I/O queues based on any one or any combination of any two or more of a priority assigned to the I/O queues, a type of I/O commands, and a length of the I/O queues;
• determining thermal margin states of the one or more non-volatile memory modules for the I/O queues based on the thermal margins and a current temperature of a non-volatile memory module on which the I/O queues are selected to be executed from among the one or more non-volatile memory modules;
• and
• resetting the priority so that I/O commands belonging to an I/O queue, among the I/O queues, having a thermal margin state, among the thermal margin states, of a normal state have priority over I/O commands belonging to an I/O queue, among the I/O queues, having thermal margin states, among the thermal margin states, of a restriction state,
• wherein a thermal margin, among the thermal margins, defines a difference between a critical temperature adapted to protect the one or more non-volatile memory modules and a restrictive temperature adapted to cause switching of the thermal margin state, and
• wherein a thermal margin state, among the thermal margin states, is determined to be the normal state in which the current temperature is lower than the restrictive temperature or the restriction state in which the current temperature is higher than the restrictive temperature.