Conductive stress-relief washers in microelectronic assemblies
AssigneeIntel Corporation
InventorHyoung Il Kim
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorHyoung Il Kim
Estimating the term…
Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation.
A microelectronic device assembly, comprising:
An electronic computing device, comprising:
Dependencies are inferred from the claim text.