Method and apparatus for cooling components in an electronic device

A method for removing heat from electromechanical components in an electronic device, the method comprising:

• storing in the electronic device, for each of the electromechanical components, a plurality of predetermined temperature states, a plurality of system actions associated with the plurality of predetermined temperature states, and a ranking of the system actions;
• determining an individual temperature state for each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components using a controller in the electronic device, wherein:
• each determined individual temperature state is one of the plurality of predetermined temperature states;
• at least one of the determined individual temperature states is different from at least one other of the determined individual temperature states;
• each of the electromechanical components is sampled at an individual sample rate based at least partly on a temperature fluctuation rate of each of the electromechanical components, as determined through a thermal time constant related to a thermal mass of a corresponding electromechanical component;
• and
• the temperature data for each of the electromechanical components is sampled at the individual sample rate corresponding to each of the electromechanical components;
• during overheating and non-overheating operation of the electronic device, assigning a device temperature state of the electronic device based on a highest ranked temperature state of the determined individual temperature states;
• and
• responsive to at least a first electromechanical component and a second electromechanical component having individual temperature states that match the assigned device temperature state of the electronic device:
• determining a first system action and a second system action associated with the first electromechanical component and the second electromechanical component, respectively, wherein the first system action and the second system action are different for a same determined individual state;
• determining a device system action for the electronic device by selecting one of the first system action or the second system action based on the ranking of the system actions;
• and
• controlling an operation of a cooling unit in the electronic device based on the determined device system action.

A temperature modification system for an electronic device, the system comprising:

• a temperature modification unit configured to add heat to or remove heat from electromechanical components in the electronic device;
• a memory configured to store, for each of the electromechanical components, a plurality of predetermined temperature states, a plurality of system actions associated with the plurality of predetermined temperature states, and a ranking of the system actions;
• and
• a controller configured to:
• determine an individual temperature state for each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein:
• each determined individual temperature state is one of a set of predetermined temperature states;
• at least one of the determined individual temperature states is different from at least one other of the determined individual temperature states;
• each of the electromechanical components is sampled at an individual sample rate based at least partly on a temperature fluctuation rate of each of the electromechanical components, as determined through a thermal time constant related to a thermal mass of a corresponding electromechanical component;
• and
• the temperature data for each of the electromechanical components is sampled at the individual sample rate corresponding to each of the electromechanical components;
• during overheating and non-overheating operation of the electronic device, assign a device temperature state of the electronic device based on a highest ranked temperature state of the determined individual temperature states;
• and
• responsive to at least a first electromechanical component and a second electromechanical component having individual temperature states that match the assigned device temperature state:
• determine a first system action and a second system action associated with the first electromechanical component and the second electromechanical component, respectively, wherein the first system action and the second system action are different for a same determined individual state;
• determine a device system action for the electronic device by selecting one of the first system action or the second system action based on the ranking of the system actions;
• and
• control an operation of the temperature modification unit based on the determined device system action.