Developing method, developing apparatus, and computer-readable recording medium

A method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, the method comprising:

• rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported;
• supplying a developing solution through a discharge hole of a wetted part positioned above the substrate onto the resist film by moving the wetted part from a preceding region in the surface of the substrate to another region of the surface of the substrate in a diameter direction of the substrate, such that the developing solution is widely spread on a surface of the resist film;
• and
• positioning the wetted part having a surface that faces the surface of the substrate, above the preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is initially supplied through the discharge hole and to which a line width of the resist pattern needs to be adjusted, in the surface of the substrate, arranging the wetted part above the preceding region at a position above the preceding region, and stopping the wetted part at the position for a predetermined period of time to hold the developing solution.