Catadioptric projection objective comprising deflection mirrors and projection exposure method

A lithographic method for manufacturing an integrated circuit, the method comprising:

• scanning a wafer with respect to a catadioptric projection objective comprising a plurality of optical elements;
• imaging a pattern on a mask onto a wafer while scanning the wafer with respect to the catadioptric projection objective, the imaging comprising;
• illuminating the mask arranged in an object surface of a catadioptric projection objective with radiation;
• imaging, using the radiation, the pattern into a first intermediate image using a first objective part of a catadioptric projection objective;
• imaging, using the radiation, the first intermediate image to a second intermediate image using a second objective part of the catadioptric projection objective, wherein imaging the first intermediate image to the second intermediate image comprises reflecting light from a concave mirror arranged in a region of a pupil surface in the second objective part;
• imaging, using the radiation, the second intermediate image into an image field arranged in an image surface using a third objective part of the catadioptric projection objective, the wafer being arranged at the image surface,
• wherein the catadioptric projection objective comprises a first deflection mirror configured to deflect the radiation from the object field towards the concave mirror in the second objective part and a second deflection mirror configured to deflect the radiation from the concave mirror towards the image field, the first and second deflection mirrors being mechanically coupled to a displacement device arranged to displace the first and second deflection mirrors along a first direction;
• and
• manipulating one or more of the optical elements while scanning the wafer with respect to the catadioptric projection objective to reduce errors in the image at the image field.