System and methods for cooling optical components
AssigneeScience Research Laboratory, Inc.
InventorsAland K. Chin, Richard H. Chin, Alan Nelson
Life of this patent
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Abstract
A cooling device includes a thermally conductive object having an opening configured to receive an optical component, the opening being configured such that the optical component is thermally and optically operationally connected to the thermally conductive and electrically conductive object. One or more cooling components, microchannel coolers in one instance, are also thermally operationally connected to the thermally conductive and electrically conductive object. Methods of use are disclosed.
Claims14
A cooling device comprising:
- a thermally conductive metal object having an opening configured to receive a fiber optic connector, the opening being configured such that the received fiber optic connector is thermally and optically operatively connected to the thermally conductive metal object;
- a solid portion of the thermally conductive metal object being configured to completely wrap around the fiber optic connector;
- and
- one or more microchannel coolers thermally operatively connected to the thermally conductive metal object;
- the cooling device configured to remove more than 500 Watts of waste optical power from the fiber optic connector.
A method for removing more than 500 Watts of waste optical power from a fiber optic connector, the method comprising:
- inserting the fiber optic connector in an opening in a thermally conductive metal object;
- the opening being configured such that the fiber optic connector is thermally and optically operatively connected to the thermally conductive object;
- wherein at least a solid portion of the thermally conductive metal object completely wraps around the fiber optic connector;
- and
- thermally operatively connecting one or more microchannel coolers to the thermally conductive metal object;
- waste optical power from the optical component being substantially absorbed by the thermally conductive object and heat generated by absorbed waste optical power being removed by the one or more microchannel coolers wherein more than 500 Watts of the waste optical power can be removed.
Dependencies are inferred from the claim text.