Optical transceiver by FOWLP and DOP multichip integration

An optical system comprising:

• an optical transceiver device comprising:
• a board with a plurality of prefabricated surface bonding sites;
• a first chip comprising multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer, the first chip being disposed on the board by bonding the dielectric redistribution layer via a plurality of conductor balls respectively on the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) formed in the dielectric molding layer and one or more prefabricated recessed structures;
• a second chip comprising photonics devices embedded in a silicon on insulator (SOI) wafer having a front surface with multiple conductor bumps and a fiber coupling structure, the second chip being stacked over the first chip with the multiple conductor bumps on the front surface being bonded respectively to the soldering material in the multiple TMVs;
• and
• an optical fiber fixed within V-grooves defined between recessed regions in the front surface of the second chip and the one or more prefabricated recessed structures in the first chip aligned with the fiber coupling structure in the front surface of the second chip, such that a first fiber coupling structure is direct physical contact with a first conductor bump within a first V-groove;
• and
• an interface coupled to the optical transceiver device.