Devices with optical ports in fan-out configurations

A system, comprising:

• a substrate comprising a plurality of electrical ports on a first face of the substrate, a plurality of optical ports on a second face of the substrate, wherein the second face is opposite that of the first face, a plurality of through substrate conducting vias, and a plurality of monolithically integrated optical waveguides;
• and
• an integrated circuit comprising a plurality of electrical connections and a plurality of optical connections, wherein a first face of the integrated circuit is coupled directly to the second face of the substrate, and wherein the plurality of electrical connections are communicatively coupled by the plurality of through substrate conducting vias to the plurality of electrical ports of the substrate and the plurality of optical connections are communicatively coupled by the plurality of monolithically integrated optical waveguides to the plurality of optical ports of the substrate;
• wherein the plurality of optical ports are positioned in a fan-out configuration on the second face of the substrate such that the plurality of optical ports are positioned to surround the integrated circuit;
• the substrate further comprising:
• a conducting through substrate via communicatively coupling the electrical connections of the integrated circuit with the electrical ports of the substrate, and
• a plurality of electrical ports positioned in a fan-out configuration on the first face of the substrate;
• and
• the integrated circuit further comprising:
• a plurality of electronic connections communicatively coupled to the plurality of electrical ports of the substrate by conducting traces and conducting vias.

An integrated circuit system, comprising:

• a silicon-on-insulator substrate comprising a plurality of electrical ports on a first face of the substrate, a plurality of optical ports on a second face of the substrate, a plurality of electrical traces, and a plurality of monolithically integrated optical waveguides defined in a thin layer of silicon on the second face of the substrate;
• and
• an integrated circuit comprising a plurality of electrical connections and a plurality of optical connections, wherein a first face of the integrated circuit is directly coupled to the second face of the substrate, and wherein the electrical connections are communicatively coupled by the plurality of electrical traces to the plurality of electrical ports of the substrate and the plurality of optical connections are communicatively coupled by the plurality of monolithically integrated optical waveguides to the plurality of optical ports of the substrate;
• wherein the plurality of optical ports are positioned in a fan-out configuration on the second face of the substrate such that the plurality of optical ports are positioned to surround the integrated circuit, and wherein the plurality of electrical ports are positioned in a second fan-out configuration on the first face of the substrate,
• the substrate further comprising:
• a conducting through substrate via communicatively coupling the electrical connections of the integrated circuit with the electrical ports of the substrate, and
• a plurality of electrical ports positioned in a fan-out configuration on the first face of the substrate;
• and
• the integrated circuit further comprising:
• a plurality of electronic connections communicatively coupled to the plurality of electrical ports of the substrate by conducting traces and conducting vias.