Probe card having lead part for removing excessive solder

A probe card comprising:

• a ceramic substrate;
• an electrode pad and a via pad connected to each other by an electrode connection part having a width smaller than those of the via pad and the electrode pad, the electrode connection part having a thickness the same as that of the electrode pad;
• a bonding pad provided on the electrode pad and disposed inwardly of the electrode pad;
• a probe bonded to the bonding pad via a solder layer between the bonding pad and the probe;
• and
• a lead part protruding from a side surface of the bonding pad and extending on the electrode connection part, the lead part having a width smaller than that of the electrode connection part,
• wherein the lead part is formed of a same material as the bonding pad.

A probe card comprising:

• a ceramic substrate;
• a first electrically conductive layer disposed on the ceramic substrate, and including an electrode pad, a via pad, and an electrode connection part connecting the electrode pad and the via pad to each other, the electrode connection part having a width smaller than those of the via pad and the electrode pad;
• a second electrically conductive layer entirely, directly disposed on the first electrically conductive layer, and including a bonding pad and a lead part made of a same material, the lead part protruding from a side surface of the bonding pad, extending onto the electrode connection part, and having a width smaller than those of the electrode connection part and the bonding pad;
• a solder layer disposed on the bonding pad;
• and
• a probe attached to the bonding pad through the solder layer.