Testing probe and semiconductor testing fixture, and fabrication methods thereof
AssigneeTongfu Microelectronics Co., Ltd.
InventorLei Shi
Life of this patent
Estimating the term…
Loading patent…
AssigneeTongfu Microelectronics Co., Ltd.
InventorLei Shi
Estimating the term…
Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A plurality of first testing pins is formed on the substrate, each first testing pin including a first testing terminal on a top and a first connection terminal on a bottom. An insulating layer is formed on a sidewall surface of each first testing pin. A number of second testing pins are formed on the insulating layers, each second testing pin including a second testing terminal on a top thereof and a second connection terminal on a bottom thereof. A first concave surface is formed on a top of the second testing terminal, and surrounds a corresponding first testing pin.
A testing probe, comprising:
A semiconductor testing fixture, comprising a substrate and a plurality of testing probes, each of the plurality of testing probes comprising:
A testing probe, comprising:
Dependencies are inferred from the claim text.