Temperature sensor integrated type semiconductor pressure sensor apparatus

A temperature sensor integrated type semiconductor pressure sensor apparatus in which a pressure sensor module and a temperature sensor module are contained in a resin enclosure,

• wherein the resin enclosure includes:
• a pressure guiding path containing a pressure detection device of the pressure sensor module;
• a container provided adjacent to the pressure guiding path, containing the temperature sensor module;
• and a protrusion provided such that part of the container protrudes further than an inlet of the pressure guiding path,
• wherein the temperature sensor module includes:
• a temperature detection device fixed at the tip of the protrusion;
• a lead wire covered with a lead wire protection material;
• a terminal connected to the temperature detection device via the lead wire;
• and a resin covering the temperature detection device, the lead wire covered with the lead wire protection material, and the terminal, and
• wherein the temperature detection device, the lead wire and the terminal are integrated together by the resin, and
• wherein a portion of the resin is provided between the lead wire protection material and an inner space of the container.