High-temperature headers for sensing elements

A transducer assembly, comprising:

• a transducer element, the transducer element comprising:
• one or more electrode portions;
• and
• one or more interconnect regions in communication with the corresponding one or more electrode portions;
• a header assembly in communication with the transducer element, the header assembly, comprising:
• a header portion having a first side and a second side, the header portion comprising one or more bores extending through the header portion from the first side to the second side;
• one or more header pins disposed within and extending through the one or more bores of the header portion, the one or more header pins comprising a platinum material, the one or more header pins protruding partially into and in electrical communication with the corresponding one or more interconnection regions;
• and
• one or more brazing portions corresponding to the one or more header pins, wherein the one or more brazing portions seal the one or more header pins to inner walls of the corresponding one or more bores,
• wherein the interconnect regions comprise a platinum-based glass frit to electrically connect the one or more header pins of the header assembly to the corresponding one or more electrode portions of the transducer element.

A method, comprising:

• mounting a header assembly to a leadless transducer assembly, wherein the leadless transducer assembly comprises:
• a transducer element, comprising:
• one or more electrode portions;
• one or more interconnect regions in communication with the corresponding one or more electrode portions;
• wherein the header assembly comprises:
• a header portion having a first side and a second side, the header portion comprising one or more bores extending through the header portion from the first side to the second side;
• inserting one or more platinum header pins within and extending through the one or more bores of the header portion, the one or more header pins protruding partially into and in electrical communication with the corresponding one or more interconnection regions;
• brazing the one or more platinum header pins to inner walls of the corresponding one or more bores;
• and
• joining the header assembly to the leadless transducer assembly such that one or more interconnect regions are in electrical communication with the corresponding one or more platinum header pins.