Heat storage device and heat storage module including the same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHironori Tomita, Toyoji Gushima
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHironori Tomita, Toyoji Gushima
Estimating the term…
A heat storage device includes: a heat storage material that absorbs or release latent heat with a phase transition between a liquid phase and a solid phase; and a heat conduction member that includes a contact surface contacting the heat storage material. The heat conduction member has a thermal conductivity higher than a thermal conductivity of the heat storage material. The contact surface includes an upstream region and a downstream region that is located at downstream side of the upstream region in a flowing direction of a heat medium. A wettability of the contact surface with respect to the heat storage material is higher in the downstream region than in the upstream region.
A heat storage device for use by being immersed in a heat medium that flows from upstream to downstream, the heat storage device comprising:
A heat storage module comprising:
A heat storage device for use by being immersed in a heat medium that flows from upstream to downstream, the heat storage device comprising:
A heat storage module comprising:
Dependencies are inferred from the claim text.