Filling material, a sealing structure and a method of making the sealing structure

A method of making a sealing structure for a filling material in which said filling material is provided on a device body having an insert hole, a bottom portion of which has a semi-spherical end portion, said device body further having a bushing tool in a cylindrical configuration to form a sealing space between an outer surface of said bushing tool and an inner surface of said insert hole, said filling material having a liquid epoxy resin, a powdered metal and a hardening agent in which said epoxy resin is hardened by said hardening agent, or said epoxy resin is hardened by said hardening agent and concurrently said epoxy resin being charred by a heat treatment after hardened;

• said method comprising steps of:
• providing said filling material into said insert hole;
• inserting said bushing tool into said insert hole, said bushing tool having an outer diameter corresponding to an inner diameter of said insert hole, and having a leading end which has a semi-spherical end portion corresponding to said semi-spherical end portion of said insert hole;
• pushing said bushing tool into said insert hole by a predetermined amount as a tight-fitting engagement procedure and hardening said epoxy resin to tightly provide said epoxy resin at said sealing space between said bushing tool and said insert hole;
• and
• further heat treating said device body, so that said filling material is solidified at said sealing space to produce said powdered metal with said epoxy resin charred with said powdered metal isolated from oxygen in the atmosphere.