Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

A thermosetting resin composition comprising:

• (A) a resin composition having an unsaturated maleimide group, which is a reaction product produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, wherein in producing said reaction product, the maleimide compound (a) and the amine compound (b) are used in a ration that satisfies the equivalent ration (Ta/Tb) in a range of 1.0<Ta/Tb≤10.0, where (Ta/Tb) is the equivalent ratio of the equivalent (Ta) of the maleimide group in the maleimide compound (a) to the equivalent (Tb) of the —NH2 group in the amine compound (b);
• (B) a thermosetting resin;
• (C) a modified imidazole compound represented by any one of the following general formulae (I) and (II):
• wherein R3, R4, R5 and R6 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having from 1 to 20 carbon atoms or a phenyl group;
• and A represents an alkylene group or an aromatic hydrocarbon group,
• wherein R3, R4, R5 and R6 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having from 1 to 20 carbon atoms or a phenyl group;
• and B represents a single bond, an alkylene group, an alkylidene group, an ether group or a sulfonyl group;
• and
• (D) an amine compound having an acidic substituent represented by the following general formula (IV):
• wherein R1 each independently represent a hydroxyl group, a carboxyl group or a sulfonic acid group as the acidic substituent;
• R2 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having from 1 to 5 carbon atoms or a halogen atom;
• x represents an integer of from 1 to 5;
• and y represents an integer of from 0 to 4, provided that a sum of x and y is 5.