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US 10,118,816 B2Granted
Method of forming a protective coating for a packaged semiconductor device
AssigneeInfineon Technologies AG
InventorsKlaus Elian, Horst Theuss
Life of this patent
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Abstract
A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.
Claims13
A packaged semiconductor device, comprising:
- a flip-chip assembly, comprising a first semiconductor substrate comprising at least one integrated semiconductor device, and a second substrate connected to the first substrate, wherein a main surface of the first semiconductor substrate faces and is spaced apart from the second substrate;
- a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate,
- wherein a first section of the main surface is exposed from the parylene coating.
Dependencies are inferred from the claim text.