Method and device for embossing of a nanostructure

A method for embossing a nanostructure that is formed on a nanostructure punch into a punch surface of a curable material which has been applied to a substrate, the method comprising:

• aligning the nanostructure relative to the punch surface,
• holding and moving the nanostructure punch by means of a punch chucking apparatus;
• and
• embossing the punch surface with the nanostructure by
• A) prestressing the nanostructure punch by controlling a pin of the punch chucking apparatus to deform the nanostructure punch with pressure applied to a backside of the nanostructure punch by the pin,
• B) contacting a partial area of the punch surface with the nanostructure punch, and
• C) removing a peripheral edge of the nanostructure punch from the punch chucking apparatus while maintaining contact of the pin with the backside of the nanostructure punch, thereby automatically contacting a remaining surface of the punch surface in a controlled manner based on the prestressing of the nanostructure punch.