Cutting method of a multilayer structure containing a brittle layer

A cutting method of a multilayer structure containing a brittle layer, the cutting method comprising:

• cutting the multilayer structure to form a cut edge;
• and
• causing a laser beam to strike an edge of the brittle layer adjacent to the cut edge so as to peel off a layer of chippings at the edge of the brittle layer, wherein a spot of the laser beam on the brittle layer satisfies 0.5≤b/a≤2, where a is a diameter of the spot of the laser beam on a surface of the brittle layer, and b is the distance from the center of a focus of the laser beam to the edge of the brittle layer along a direction perpendicular to a thickness direction of the brittle layer.