Method for forming solder deposits
AssigneePac Tech—Packaging Technologies GmbH
InventorGhassem Azdasht
Life of this patent
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Abstract
A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.
Claims9
A method for forming metallic solder deposits on fine pitch elevated contact metallizations formed on a substrate of a semiconductor component, comprising the steps of:
- bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer,
- simultaneously heating the substrate and cooling the metallic solder material layer during the physical contact, and
- subsequently separating the contact metallizations from the metallic solder material layer, wherein the contact metallizations are wetted with solder material.
Dependencies are inferred from the claim text.