Substrate cleaning apparatus and polishing apparatus

A substrate cleaning apparatus, comprising:

• a cleaning vessel for housing a substrate therein;
• a substrate holder arranged in the cleaning vessel;
• a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder;
• a plurality of cleaning liquid nozzles for supplying a cleaning liquid toward a hydrophilic inner surface of the cleaning vessel, the hydrophilic inner surface surrounding the substrate holder, each one of the plurality of cleaning liquid nozzles being oriented outwardly in a non-vertical direction away from the substrate holder and toward the hydrophilic inner surface;
• and
• an oscillation mechanism for causing the plurality of cleaning liquid nozzles to oscillate,
• wherein the plurality of cleaning liquid nozzles are arranged so as to form a film of the cleaning liquid on the hydrophilic inner surface such that the film surrounds an entire circumference of the substrate holder while the chemical liquid nozzle supplies the chemical liquid onto the substrate held by the substrate holder,
• the hydrophilic inner surface comprises a front surface, a back surface, and two side surfaces, and
• the plurality of cleaning liquid nozzles includes a first nozzle oriented toward the front surface, a second nozzle oriented toward the back surface, a third nozzle oriented toward one of the two side surfaces, and a fourth nozzle oriented toward other of the two side surfaces.