Forming edge etch protection using dual layer of positive-negative tone resists
AssigneeGlobalfoundries Inc.
InventorsChristopher B. Shing, Joyce C. Liu, Richard D. Kaplan, Timothy J. Wiltshire, Darius Brown
Life of this patent
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Abstract
Methods of forming edge etch protection using dual layers of positive-negative tone resists. According to a method, a wafer substrate is provided. A first type resist is deposited on a surface of the wafer substrate. The first type resist is patterned and a resist ring is created around a peripheral edge of the wafer substrate. The resist ring is cured. A second type resist is deposited on the surface of the wafer substrate and the resist ring. The second type resist is different from the first type resist.
Claims15
A method, comprising:
- providing a wafer substrate;
- depositing a negative tone resist on a surface of the wafer substrate;
- exposing to light a portion of the negative tone resist, the portion being at a peripheral edge of the wafer substrate, wherein exposing the portion of the negative tone resist comprises applying an optical edge bead removal (EBR) process in the exposing;
- after exposing the portion of the negative tone resist to light, developing the negative tone resist to create a resist ring around the peripheral edge of the wafer substrate;
- curing the resist ring;
- and
- depositing a positive tone resist on the surface of the wafer substrate and the resist ring.
A method comprising:
- depositing a layer of a negative tone resist on a substrate;
- exposing to light a portion of the negative tone resist at a peripheral edge of the substrate, and developing the negative tone resist to form an edge protective resist layer, wherein exposing the portion of the negative tone resist comprises applying an optical edge bead removal (EBR) process in the exposing;
- performing a curing process on the edge protective resist layer;
- and
- after the curing process, depositing a layer of a positive tone resist on the substrate.
A method, comprising:
- providing a substrate;
- depositing a layer of a negative tone resist on the substrate;
- exposing to light the negative tone resist around a peripheral edge of the substrate forming an edge protective resist layer, wherein exposing the negative tone resist comprises applying an optical edge bead removal (EBR) process in the exposing;
- developing the negative tone resist to remove a center portion of the negative tone resist;
- performing a curing process on the edge protective resist layer;
- after the curing process, depositing a layer of a positive tone resist on the substrate;
- patterning the positive tone resist;
- and
- transferring the pattern into the substrate, wherein the edge protective resist layer of the negative tone resist protects the peripheral edge of the substrate from being patterned.
Dependencies are inferred from the claim text.