Polyphenylene ether resin composition, and a prepreg and a copper clad laminate made therefrom
AssigneeGuangdong Shengyi Sci. Tech Co., Ltd.
InventorXian-Ping Zeng
Life of this patent
Estimating the term…
Loading patent…
AssigneeGuangdong Shengyi Sci. Tech Co., Ltd.
InventorXian-Ping Zeng
Estimating the term…
The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.
A polyphenylene ether resin composition comprising:
Dependencies are inferred from the claim text.