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US 10,036,952 B2Granted
Photosensitive polyimide compositions
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsSanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
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Abstract
This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
Claims45
A photosensitive composition, comprising:
- at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons, wherein the at least one fully imidized polyimide polymer is prepared from at least one diamine, and the at least one diamine comprises a compound selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),
- in which each of R1, R2, R3, R4, R5, R11, R12, R13 and R14, independently, is H, a substituted or unsubstituted C1-C6 linear or branched alkyl group, or a C5-C7 cycloalkyl group;
- at least one solubility switching compound;
- at least one photoinitiator;
- and
- at least one solvent;
- wherein the composition is capable of forming a film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
4 more elements
A process, comprising:
- (a) providing a dry film structure comprising:
- a carrier substrate;
- optionally, a protective layer;
- and
- a photosensitive polymeric layer between the carrier substrate and the optional protective layer, the photosensitive polymeric layer comprising at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons;
- at least one solubility switching compound;
- and at least one photoinitiator;
- wherein the at least one fully imidized polyimide polymer is prepared from at least one diamine, and the at least one diamine comprises a compound selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),
- in which each of R1, R2, R3, R4, R5, R11, R12, R13, and R14, independently, is H, a substituted or unsubstituted C1-C6 linear or branched alkyl group, or a C5-C7 cycloalkyl group;
- (b) optionally, removing the protective layer, if present, from the dry film structure;
- (c) applying the structure obtained in step (b) onto an electronic substrate to form a laminate, the laminate comprising the photosensitive polymeric layer between the electronic substrate and the carrier substrate;
- and
- (d) converting the photosensitive polymeric layer into a patterned layer;
- wherein the patterned layer has a thickness of at most about 5 microns and comprises at least one element having a feature size of at most about 3 microns.
11 more elements
A photosensitive composition, comprising:
- at least one polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons, wherein the at least one polyimide polymer is prepared from at least one diamine, and the at least one diamine comprises a compound selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),
- in which each of R1, R2, R3, R4, R5, R11, R12, R13, and R4, independently, is H, a substituted or unsubstituted C1-C6 linear or branched alkyl group, or a C5-C7 cycloalkyl group;
- at least one solubility switching compound;
- at least one photoinitiator;
- and
- at least one solvent;
- wherein the composition is capable of forming a film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer, and the solubility switching compound increases a dissolution rate of the film in cyclopentanone compared to a film made from a photosensitive composition containing the same components without the solubility switching compound.
4 more elements
A process, comprising:
- (a) providing a dry film structure comprising:
- a carrier substrate;
- optionally, a protective layer;
- and
- a photosensitive polymeric layer between the carrier substrate and the optional protective layer, the photosensitive polymeric layer comprising at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons, in which the dissolution rate of the polymeric layer in cyclopentanone is greater than about 0.15 microns/second;
- at least one solubility switching compound;
- and at least one photoinitiator;
- wherein the at least one fully imidized polyimide polymer is prepared from at least one diamine, and the at least one diamine comprises a compound selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),
- in which each of R1, R2, R3, R4, R5, R11, R12, R13, and R14, independently, is H, a substituted or unsubstituted C1-C6 linear or branched alkyl group, or a C5-C7 cycloalkyl group;
- (b) optionally, removing the protective layer, if present, from the dry film structure;
- and
- (c) applying the structure obtained in step (b) onto an electronic substrate to form a laminate, the laminate comprising the photosensitive polymeric layer between the electronic substrate and the carrier substrate.
9 more elements
Dependencies are inferred from the claim text.