Filter assemblies, tuning elements and method of tuning a filter

A filter assembly comprising:

• a housing having a top cover, a bottom cover, and a sidewall, the top cover, the bottom cover and the sidewall defining an internal cavity;
• and
• a printed circuit board mounted at least partially within the housing, the printed circuit board comprising a conductive layer that comprises a plurality of resonating elements that form part of a resonant cavity filter,
• wherein the sidewall comprises a slot, and wherein a portion of the printed circuit board extends through the slot to reside outside the housing,
• wherein at least one of the top cover or the bottom cover comprises an integral tuning element.

A filter assembly comprising:

• a housing having a top cover, a bottom cover, and a frame that includes at least one sidewall, wherein the top cover, the bottom cover and the at least one sidewall define an internal cavity;
• a plurality of resonators in the internal cavity;
• and
• a twistable tuning element that is integral with the top cover,
• wherein at least one of the plurality of resonators includes a narrow base and a widened distal end, and
• wherein the plurality of resonators are integral with the frame and aligned in a first plane that is parallel to a plane defined by the top cover.

A filter assembly, comprising;

• :
• a housing that defines an internal cavity, the housing comprising at least one cover and a frame;
• and
• a substantially planar metal resonator plate mounted within the internal cavity, the substantially planar metal resonator plate comprising a conductive layer comprising at least one resonator,
• wherein at least the conductive layer and a size and shape of the internal cavity are configured to achieve a pre-selected filter response, and
• wherein a first type of solder having a first melting point is used to solder attaches the substantially planar metal resonator plate to the housing frame, and wherein a second type of solder having a second melting point that is lower than the first melting point is used to solder attaches the at least one cover to the housing frame.