Light emitting device package and backlight unit comprising the same

A light emitting element package, comprising:

• a lead frame;
• a light emitting element on the lead frame;
• a molded material combined with the lead frame and haying an opening for emitting light generated by the light emitting element;
• and
• a reflection structure having an opening that corresponds to the opening of the molded material and contacting the molded material,
• wherein the reflection structure comprises a radial surface formed in a radial shape extending radially from the molded material relative to a direction along which light generated by the light emitting element emits, and
• wherein the radial surface of the reflection structure forms a first angle with a main emission direction of light generated by the light emitting element, from a point where the radial surface contacts the molded material to a first point away from the molded material, and forms a second angle with the main emission direction from the first point to a second point further away from the molded material compared to the first point, wherein the second angle is greater than the first angle.

A light emitting element package, comprising:

• a lead frame;
• a light emitting element on the lead frame;
• a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element;
• a reflection structure having an opening that corresponds to the opening of the molded material, and contacting the molded material;
• a supporting portion provided discretely or continuously on the molded material to fix the reflection structure onto the molded material;
• and
• an adhesive layer provided in at least part of a region between the molded material and the reflection structure, and having a first thickness in an area adjacent to the light emitting element and a second thickness in an area away from the light emitting element, wherein the first thickness is greater than the second thickness.

A method of manufacturing a light emitting element package, comprising:

• providing a lead frame, a light emitting element, and a molded material in a package, the molded material having an opening for emitting light generated by the light emitting element;
• aligning a reflection structure in contact with the molded material, the reflection structure having an opening that corresponds to the opening of the molded material;
• and
• fixing the reflection structure onto the molded material with an adhesive layer provided between the molded material and the reflection structure, the adhesion layer having a first thickness in an area adjacent to the light emitting element and a second thickness less than the first thickness in an area away from the light emitting element.

A method of manufacturing a light emitting element package, comprising:

• providing a lead frame, a light emitting element, and a molded material in a package, the molded material having a first opening for emitting light generated by the light emitting element, the first opening being defined by a first inner surface having a first slope line;
• aligning a reflection structure in contact with the molded material, the reflection structure having a second opening that corresponds to the first opening of the molded material, the second opening being defined by a second inner surface having a second slope line;
• and
• fixing the reflection structure onto the molded material, such that the first slope line and the second slope line form a continuous straight line,
• wherein fixing the reflection structure onto the molded material comprises providing an adhesive layer between the molded material and the reflection structure,
• wherein the adhesive layer has a first thickness in an area adjacent to the light emitting element and a second thickness in an area away from the light emitting element, and
• wherein the first thickness is greater than the second thickness.

A method of manufacturing a light emitting element package, comprising:

• providing a lead frame, a light emitting element, and a molded material in a package, the molded material having a first inner surface defining a first opening for emitting light generated by the light emitting element;
• aligning a reflection structure in contact with the molded material, the reflection structure having a second inner surface defining a second opening that corresponds to the first opening of the molded material;
• and
• fixing the reflection structure onto the molded material,
• wherein the molded material comprises a plurality of recesses along a circumference of the first opening of the molded material, and the reflection structure comprises a plurality of protrusions along a circumference of the second opening of the reflection structure, and
• wherein fixing the reflection structure onto the molded material comprises mating the plurality of protrusions of the reflection structure with the plurality of recesses of the molded material and providing an adhesive layer between the molded material and the reflection structure,
• wherein the adhesive layer has a first thickness in an area adjacent to the light emitting element and a second thickness in an area away from the light emitting element, and
• wherein the first thickness is greater than the second thickness.