Method and apparatus for integrating a surface acoustic wave filter and a transceiver
AssigneeRichWave Technology Corp.
InventorsYu-Ling Chiu, Tsyr-Shyang Liou
Life of this patent
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Abstract
A method and an apparatus for integrating a surface acoustic wave (SAW) filter and a transceiver are provided to solve the problem of having a large area of the prior-art integration of a SAW filter and a transceiver; wherein a device for integrating a SAW filter and a transceiver is provided and a component stack method is used to accomplish the integration of the SAW filter and the transceiver, and thus besides featuring a low cost and a small area as well as avoiding a signal loss, the invention can further include a design of encapsulating other components and chips, or even suitable to be used for various integrated circuit packaging technologies (such as QFP and BGA, etc.)
Claims20
A device for integrating a surface acoustic wave (SAW) filter and a transceiver, comprising:
- a substrate, forming a conductive layer thereon for connecting a circuit;
- a transceiver, being disposed on said substrate and electrically coupled with said conductive layer by a metal lead;
- a surface acoustic wave filter, being disposed on said transceiver and covered by an air cavity and having a gap reserved between said air cavity and said surface acoustic wave filter, and said conductive layer being electrically coupled with said surface acoustic wave components;
- and
- a molding compound, for encapsulating the circuit among said substrate, said transceiver and said surface acoustic wave filter;
- thereby, a component stack method is used to accomplish the integration of said surface acoustic wave filter and said transceiver.
A method for integrating a surface acoustic wave (SAW) filter and a transceiver, comprising the steps of:
- disposing a substrate;
- coating an epoxy layer on said substrate;
- disposing a transceiver on said substrate;
- forming a thin isolation layer on said transceiver;
- disposing a surface acoustic wave (SAW) filter on said transceiver;
- electrically coupling said SAW filter, said transceiver and said conductive layer by a metal lead;
- encapsulating the circuit among said substrate, said transceiver and said SAW filter by a molding compound;
- and
- shaping an integrated chip.
A method for integrating a surface acoustic wave (SAW) filter and a transceiver, comprising the steps of:
- disposing a lead frame;
- coating an epoxy layer on a chip substrate of said lead frame;
- disposing a transceiver on said chip substrate of said lead frame;
- forming a thin isolation layer on said transceiver;
- disposing a SAW filter on said transceiver;
- electrically coupling said SAW filter, said transceiver and said lead frame by a metal lead;
- encapsulating the circuit among said lead frame, said SAW filter and said transceiver;
- and
- forming an integrated chip.
Dependencies are inferred from the claim text.