Anisotropic conductive adhesive

An anisotropic conductive connection method comprising:

• supplying an anisotropic conductive adhesive to a connection terminal of a wiring board;
• preliminarily connecting a connection terminal of an electronic component to the connection terminal of the wiring board while arranging the anisotropic conductive adhesive therebetween;
• and
• heating the electronic component while applying a pressure of 1 MPa or less to the electronic component to connect the wiring board with the electronic component and to completely or almost completely cure the adhesive;
• wherein the adhesive comprises:
• a binder resin composition and conductive particles that include a metal flake powder and are dispersed in the binder resin composition, wherein:
• the metal flake powder enables electrical connection between the connection terminals and the conductive particles due to surface connection;
• the metal flake powder has a major axis of 10 to 40 μm, a thickness of 0.5 to 2 μm, and an aspect ratio of 5 to 50;
• and
• an amount of the conductive particles contained in the anisotropic conductive adhesive is 5 to 35 mass %.