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US RE43,980 E1Granted
Laser decapsulation method
AssigneeIntersil Corporation
InventorRobert K. Lowry
Life of this patent
Estimating the term…
Abstract
A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24. Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned and scanned using an X, Y table 2. A hinged end 4 rotates the device to an acute angle of incidence with respect to a laser 8. Endpoint detector 10 senses the exposed integrated circuit and moves or shuts down the laser 8.
Claims25
A method of manufacturing integrated circuits, the method comprising;
- forming encapsulated integrated circuits;
- and
- sampling select integrated circuits to verify if the finished integrated circuits are made to manufacturing specifications by selectively removing portions of the encapsulation with a laser that is suitable for breaking cross linked bonds of the encapsulant without damaging the integrated circuits, wherein a thin layer of encapsulant is left on at least one portion of at least one of the sampled integrated circuits.
A method of manufacturing integrated circuits, the method comprising:
- forming integrated circuits with a manufacturing process, wherein each integrated circuit is encapsulated to protect the integrated circuit from environmental factors;
- selecting certain formed integrated circuits;
- placing each selected integrated circuit on a stage in an enclosure;
- directing a laser beam having a select wavelength on a select portion of the encapsulant to remove the select portion of encapsulant, wherein with at least one of the select integrated circuits the select removed portion of encapsulant has a depth, the depth being less than a thickness of the encapsulant;
- monitoring the laser beam reflected off of the integrated circuit;
- moving the stage based at least in part on the monitored reflected laser beam;
- terminating the laser beam based at least in part on the monitored reflect laser beam;
- and
- testing the selected integrated circuits with the select portion of encapsulant removed to verify that the integrated circuits are formed to manufacture specifications.
6 more elements
A manufacturing method of removing encapsulant from an integrated circuit;
- the method comprising:
- placing an integrated circuit on a stage in an enclosure;
- directing a laser beam on the encapsulation of the integrated circuit, wherein the laser beam has a wavelength that is suitable for breaking cross linked bonds of the encapsulant without damaging the underlying integrated circuit;
- removing at least one select portion of the encapsulant with the laser beam;
- and
- capturing debris particles in a dust bin.
3 more elements
A method of manufacturing encapsulated devices, the method comprising:
- forming encapsulated devices with a manufacturing process, wherein each encapsulated device is encapsulated to protect the encapsulated device from environmental factors;
- selecting certain formed encapsulated devices;
- placing each selected encapsulated device on a stage in an enclosure;
- directing a laser beam having a select wavelength on a select portion of the encapsulant to remove the select portion of encapsulant;
- catching debris particles in a dust bin;
- and
- testing the selected encapsulated devices with the select portion of encapsulant removed to expose failed encapsulated devices without physical or other damage, to enable direct inspection and failure analysis procedures to determine a cause of failure.
4 more elements
A method of manufacturing encapsulated devices, the method comprising:
- forming finished encapsulated devices with a manufacturing process, wherein each finished encapsulated device is encapsulated to protect the finished encapsulated device from environmental factors;
- selecting failed finished encapsulated devices;
- placing each selected, failed finished encapsulated device on a stage in an enclosure;
- directing a laser beam having a select wavelength on a select portion of the encapsulant to remove the select portion of encapsulant;
- and
- testing the selected, failed finished encapsulated devices with the select portion of encapsulant removed.
3 more elements
A method of manufacturing encapsulated devices, the method comprising:
- forming encapsulated devices with a manufacturing process, wherein each encapsulated device is encapsulated to protect the encapsulated device from environmental factors;
- selecting certain failed encapsulated devices;
- placing each selected, failed encapsulated device on a stage in an enclosure;
- directing a laser beam having a select wavelength on a select portion of the encapsulant to remove the select portion of encapsulant;
- catching debris particles in a dust bin;
- and
- testing the selected encapsulated devices with the select portion of encapsulant removed to expose the selected, failed encapsulated devices without physical or other damage, to enable inspection of the selected, failed encapsulated devices.
4 more elements
A method of removing encapsulant from an encapsulated device, the method comprising:
- placing a finished encapsulated device on a stage in an enclosure;
- directing a laser beam on the encapsulation of the finished encapsulated device;
- and
- removing at least one select portion of the encapsulant with the laser beam.
1 more element
Dependencies are inferred from the claim text.