Method and apparatus for identifying integrated circuits
AssigneeMicron Technology, Inc.
InventorLeland R. Nevill
Life of this patent
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AssigneeMicron Technology, Inc.
InventorLeland R. Nevill
Estimating the term…
An integrated circuit and method for identifying same is described. The integrated circuit includes a programmable identification circuit for storing electronic identification information. The integrated circuit also includes an optical identification mark displaying a machine-readable optical identification code which corresponds with the electronic identification information stored in the identification circuit. The data encoded in the optical identification code may be identical with that of the electronic identification information. Alternatively, a look-up table or other correlating means may be employed to associate the optical identification code with the electronic identification information. The integrated circuit is packaged in a housing, and another optical identification mark is placed on an external surface of the housing. This second optical identification mark displays a machine-readable optical identification code which is identical or correlated to the electronic identification information stored in the identification circuit and/or the optical identification code displayed by the optical identification mark on the integrated circuit. Consequently, convenient and traceable identification of individual integrated circuits is provided during and after manufacture.
A method of identifying a plurality of substantially identical integrated circuits formed on a common substrate, comprising the steps of:
In a plurality of substantially identical integrated circuits formed on a common substrate, each of the integrated circuits including a programmable circuit for storing respective electronically readable identification code which distinguishes the integrated circuits from one another, a method of identifying the integrated circuits, comprising the steps of:
A wafer comprising a plurality of dies, each die including an integrated circuit having a programmable identification circuit that stores identification data, and each die having an optical identification mark positioned thereon and encoding information corresponding to the identification data, optical identification mark on each die being accessed through a lookup table to correspond to the electronic identification information.
A plurality of integrated circuit chips, each comprising:
A method of identifying a plurality of substantially identical integrated circuits formed on a common substrate, each of the integrated circuits being formed on a respective one of a plurality of substrate dies, the method comprising:
A method of identifying an integrated circuit, comprising:
A method of identifying an integrated circuit, comprising:
Dependencies are inferred from the claim text.