US RE39,766 E1Granted

Multi-layer circuit board

AssigneeMitac Technology Corp.

InventorYu-Chiang Cheng

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Abstract

A multi-layer circuit board includes first, second, third, fourth, fifth, sixth and seventh insulating substrates disposed sequentially one above the other; first, second, third and fourth signal wiring layers; first, second and third ground wiring layers; and a power wiring layer. Each of the first and seventh insulating substrates has a thickness ranging from 2.5 to 7.5 mil. Each of the second and sixth insulating substrates has a thickness ranging from 3 to 13 mil. Each of the third and fifth insulating substrates has a thickness ranging from 3 to 15 mil. The fourth insulating substrate has a thickness ranging from 2 to 6 mil. The first signal wiring layer has a first resistance with respect to the first ground wiring layer. The second signal wiring layer has a second resistance with respect to the first and second ground wiring layers. The third signal wiring layer has a third resistance with respect to the third ground wiring layer and the power wiring layer. The fourth signal wiring layer has a fourth resistance with respect to the third ground wiring layer. The first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

Claims18

Dependent claims

A multi-layer circuit board comprising:

first, second, third, fourth, fifth, sixth and seventh insulating substrates disposed sequentially one above the other;
a first signal wiring layer disposed on one side of said first insulating substrate opposite to said second insulating substrate;
a first ground wiring layer disposed between said first and second insulating substrates;
a second signal wiring layer disposed between said second and third insulating substrates;
a second ground wiring layer disposed between said third and fourth insulating substrates;
a power wiring layer disposed between said fourth and fifth insulating substrates;
a third signal wiring layer disposed between said fifth and sixth insulating substrates;
a third ground wiring layer disposed between said sixth and seventh insulating substrates;
and
a fourth signal wiring layer disposed on one side of said seventh insulating substrate opposite to said sixth insulating substrate;
wherein each of said first and seventh insulating substrates has a thickness ranging from 2.5 to 7.5 mil;
wherein each of said second and sixth insulating substrates has a thickness ranging from 3 to 13 mil;
wherein each of said third and fifth insulating substrates has a thickness ranging from 3 to 15 mil;
wherein said fourth insulating substrate has a thickness ranging from 2 to 6 mil;
wherein said first signal wiring layer has a first resistance with respect to said first ground wiring layer, said second signal wiring layer having a second resistance with respect to said first and second ground wiring layers, said third signal wiring layer having a third resistance with respect to said third ground wiring layer and said power wiring layer, said fourth signal wiring layer having a fourth resistance with respect to said third ground wiring layer;
and
wherein said first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

14 more elements

A multi-layer circuit board comprising:

first, second, third, fourth, fifth, sixth and seventh insulating substrates disposed sequentially one above the other;
a first signal wiring layer disposed on one side of said first insulating substrate opposite to said second insulating substrate;
a first wiring layer disposed between said first and second insulating substrates;
a second signal wiring layer disposed between said second and third insulating substrates;
a second wiring layer disposed between said third and fourth insulating substrates;
a third wiring layer disposed between said fourth and fifth insulating substrates;
a third signal wiring layer disposed between said fifth and sixth insulating substrates;
a fourth wiring layer disposed between said sixth and seventh insulating substrates;
and
a fourth signal wiring layer disposed on one side of said seventh insulating substrate opposite to said sixth insulating substrate;
wherein each of said first and seventh insulating substrates has a thickness ranging from 2.5 to 7.5 mil;
wherein each of said second and sixth insulating substrates has a thickness ranging from 3 to 13 mil;
wherein each of said third and fifth insulating substrates has a thickness ranging from 3 to 15 mil;
wherein a signal trace of said first signal wiring layer has a first resistance with respect to said first wiring layer, a signal trace of said second signal wiring layer having a second resistance with respect to said first and second wiring layers, a signal trace of said third signal wiring layer having a third resistance with respect to said third and fourth wiring layers, a signal trace of said fourth signal wiring layer having a fourth resistance with respect to said fourth wiring layer;
and
wherein said first, second, third and fourth resistances are within the range of 49.5 to 60.5 ohms.

13 more elements

Dependencies are inferred from the claim text.