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US RE38,854 E1Granted
Apparatus for and method for polishing workpiece
AssigneeEbara Corporation
InventorsMasamichi Nakashiba, Norio Kimura, Isamu Watanabe, Kaori Yoshida
Life of this patent
Estimating the term…
Abstract
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
Claims59
A polishing apparatus for polishing a surface of a workpiece comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished and pressing the workpiece against said polishing surface under a first pressing force, said top ring having a holding surface for holding the workpiece;
- a pressurized fluid source for supplying pressurized fluid;
- a plurality of openings provided in said holding surface of said top ring for ejecting said pressurized fluid supplied from said pressurized fluid source, a plurality of areas each having said openings being defined in said holding surface so that said pressurized fluid is selectively ejectable from said openings in said respective areas.
1 more element
A method of polishing a workpiece, comprising the steps of:
- holding a workpiece between a polishing surface of a turntable and a holding surface of a top ring disposed above said turntable;
- pressing the workpiece by said top ring against said polishing surface under a first pressing force;
- and
- ejecting pressurized fluid from openings in a plurality of areas in said holding surface of said top ring toward the workpiece held by said top ring, said pressurized fluid being selectively ejectable from said openings in said respective areas;
- and
- polishing the workpiece in such a state that a pressing force applied to the workpiece by said pressurized fluid is variable in a central portion and an outer circumferential portion of the workpiece, respectively.
3 more elements
A top ring for supporting the workpiece to be polished, for use in a polishing apparatus, comprising:
- a holding surface for holding the workpiece;
- and
- a plurality of openings, provided in said holding surface, from which pressurized fluid is ejected, a plurality of areas each having said openings being defined in said holding surface so that said pressurized fluid is selectively ejectable from said openings in said respective areas.
A method of polishing a surface of a workpiece, comprising:
- holding a workpiece by a top ring;
- and
- pressing the workpiece against a polishing surface of a turntable to polish a surface of the workpiece so that an annular area of said workpiece is selectively pressed,
- wherein polishing pressures applied to said workpiece are controlled on the basis of pressures detected by pressure sensors.
1 more element
A method of polishing a surface of a workpiece, comprising:
- holding a workpiece by a top ring;
- pressing the workpiece against a polishing surface of a turntable so that a polishing pressure applied to a central portion of the workpiece is different from a polishing pressure applied to an outer circumferential portion of the workpiece to polish a surface of the workpiece;
- and
- applying a pressure which is independently variable to a presser ring vertically movably disposed around said top ring for pressing said polishing surface,
- wherein said polishing pressure applied to the central portion of the workpiece and said polishing pressure applied to the outer circumferential portion of the workpiece as controlled on the basis of pressures detected by pressure sensors.
2 more elements
A method of polishing a surface of a workpiece, comprising:
- holding a workpiece on an elastic pad attached to a lower surface of a top ring;
- and
- pressing the workpiece against a polishing surface of a turntable to polish a surface of the workpiece by applying at least two pressures through said elastic pad to substantially concentric circular areas of the workpiece, respectively.
A method of polishing a surface of a workpiece, comprising:
- holding a workpiece on an elastic pad attached to a lower surface of a top ring;
- and
- pressing the workpiece against a polishing surface of a turntable to polish a surface of the workpiece by applying at least two pressures to two chambers configured above a central portion and an outer circumferential portion of the workpiece, respectively, and through said elastic pad.
A method of polishing a surface of a workpiece, comprising:
- holding a workpiece by a top ring;
- pressing the workpiece against a polishing surface of a turntable to polish a surface of the workpiece so that at least two pressures are applied to the workpiece and are different in a central portion and in an outer circumferential portion of the workpiece;
- and
- applying a pressure to a presser ring vertically movably disposed around said top ring by air pressure for pressing said polishing surface,
- wherein said at least two pressures are controlled on the basis of pressures detected by pressure sensors.
2 more elements
A method of polishing a surface of a workpiece, comprising:
- holding a workpiece by a top ring;
- applying air pressure to an interior of said top ring so that the polishing pressures applied to the workpiece are different at different radial portions of said workpiece;
- and
- applying a pressure to a presser ring vertically movably disposed around said top ring by air pressure for pressing and polishing surface,
- wherein said polishing pressures are controlled on the basis of pressures detected by pressure sensors.
2 more elements
A polishing apparatus for polishing a surface of a workpiece comprising:
- a turntable having a polishing surface thereon;
- a top ring supporting the workpiece to be polished to polish a surface of the workpiece on said polishing surface,
- a presser ring vertically movably disposed around said top ring, said presser ring being movable with respect to said top ring;
- and
- a pressing mechanism for providing polishing pressures on the workpiece by air pressure,
- wherein said polishing pressures are different in a central portion and an outer circumferential portion of the workpiece, and
- wherein said presser ring is pressed against said polishing surface under a variable pressure independently of said polishing pressures.
4 more elements
A polishing apparatus for polishing a surface of a workpiece comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished on a holding surface of said top ring and
- pressing the workpiece against said polishing surface;
- a first pressing device for pressing said top ring against said polishing surface under a first pressing force;
- a presser ring vertically movable disposed around said top ring;
- a second pressing device for pressing said presser ring against said polishing surface under a second pressing force, said second pressing force being variable with respect to said first pressing force;
- and
- a pressing mechanism for providing a third pressing force onto the workpiece, said third pressing force being different in a central portion and an outer circumferential portion of the workpiece,
- wherein said third pressing force is controlled on the basis of pressures detected by pressure sensors.
6 more elements
A polishing apparatus for polishing a surface of a workpiece comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished on a holding surface of said top ring;
- a pressing mechanism for pressing the workpiece against said polishing surface of said turntable so that a polishing pressure applied to a central portion of the workpiece is different from a polishing pressure applied to an outer circumferential portion of the workpiece to polish a surface of the workpiece;
- and
- a presser ring vertically movably disposed around said top ring, said presser ring being movable with respect to said top ring, and pressed against said polishing surface by air pressure,
- wherein said polishing pressure applied to said central portion and said polishing pressure applied to said outer circumferential portion are controlled on the basis of pressures detected by pressure sensors.
3 more elements
A workpiece carrier for holding a workpiece and pressing the workpiece against a polishing surface, and workpiece carrier comprising:
- a top ring for supporting the workpiece to be polished;
- and
- at least two pressurized chambers provided in said top ring and to which pressurized fluid is supplied, said at least two pressurized chambers comprising a central circular chamber and an annular chamber located outside of said central circular chamber,
- said central circular chamber and said annular chamber being positionable over a central circular area and an annular area of the workpiece, respectively,
- wherein a first polishing pressure applied to the central circular area of the workpiece and a second polishing pressure applied to the annular area of the workpiece are created by said pressurized fluid supplied to said central circular chamber and said annular chamber, respectively,
- wherein said first polishing pressure and second polishing pressure are controlled on the basis of pressures detected by pressure sensors.
3 more elements
A polishing apparatus for polishing a surface of a workpiece, said polishing apparatus comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished;
- and
- a pressing mechanism for pressing the workpiece against said polishing surface, said pressure mechanism being capable of applying a first polishing pressure to a central circular area of the workpiece and a second polishing pressure to a first annular area of the workpiece located outside of the central circular area, said first polishing pressure and said second polishing pressure being controllable independently of each other on the basis of pressures detected by pressure sensors.
1 more element
A polishing apparatus for polishing a surface of a workpiece, said polishing apparatus comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished;
- three pressurized chambers provided in said top ring to which pressurized fluid is supplied, said three pressurized chambers comprising a central circular chamber, a first annular chamber located outside of said central circular chamber, and a third annular chamber located outside of said first annular chamber,
- wherein said pressurized chambers can be positioned above the workpiece so that a first polishing pressure can be applied to a central circular area of the workpiece, a second polishing pressure can be applied to a first annular area of the workpiece located outside of the central circular area, and a third polishing pressure can be applied to a second annular area of the workpiece located outside of the first annular area of the workpiece,
- wherein the first, second and third polishing pressures can be created by pressurizing fluid being supplied to said first central circular chamber, said annular chamber and said third annular chamber, respectively, and
- wherein at least one of said three pressurized chambers has an opening defined in a surface on which the workpiece is held.
3 more elements
A polishing apparatus for polishing a surface of a workpiece, said polishing apparatus comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished;
- at least two pressurized chambers provided in said top ring to which pressurized fluid is supplied,
- said at least two pressurized chambers comprising a central circular chamber and an annular chamber located outside of said central circular chamber,
- wherein said central circular chamber and said annular chamber are configured so as to be positionable over a central circular area and an annular area of the workpiece, respectively,
- wherein a first polishing pressure can be applied to said central circular area of the workpiece and a second polishing pressure can be applied to the annular area of the workpiece, said first and second polishing pressures being created by said pressurized fluid being supplied to said central circular chamber and said first annular chamber, respectively;
- and
- a presser ring vertically movable with respect to said top ring, wherein said presser ring is adapted to be pressed against said polishing surface,
- wherein at least one of said at least two pressurized chambers has an opening defined in a surface on which the workpiece is held.
6 more elements
A method for polishing a surface of a workpiece, the method comprising:
- holding a workpiece by a top ring;
- pressurizing a central circular chamber in the top ring to apply a first pressure to a central circular area of the workpiece;
- pressurizing a first annular chamber in the top ring to apply a second pressure to a first annular area of the workpiece located outside of the central circular area of the workpiece;
- pressurizing a second annular chamber in the top ring to apply a third pressure to a second annular area of the workpiece located outside of the first annular area of the workpiece;
- and
- controlling the first pressure and the second pressure and the third pressure on the basis of pressures detected by pressure sensors.
3 more elements
A polishing apparatus for polishing a surface of a workpiece, comprising:
- a turntable having a polishing surface thereon;
- a top ring to support the workpiece to be polished on a holding surface of said top ring;
- a presser ring vertically movably disposed around said top ring;
- a mechanism to move said top ring vertically so that said top ring moves toward and away from said polishing surface;
- a pressing mechanism to provide a first pressing force onto the workpiece, said first pressing force being different in a central portion and an outer circumferential portion of the workpiece;
- and
- a pressing ticket to press and presser ring against said polishing surface under a second pressing force, said second pressing force being independently controllable with respect to said first pressing force,
- wherein said first pressing force is controlled on the basis of pressures detected by pressure sensors.
5 more elements
A polishing apparatus for polishing a surface comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished and pressing the workpiece against said polishing surface under a first pressing force, said top ring having a surface area facing downward to be directed toward the workpiece when the workpiece is held by said top ring;
- a pressurized fluid source for supplying pressurized fluid;
- a plurality of openings provided in said surface area of said top ring for ejecting said pressurized fluid supplied from said pressurized fluid source, a plurality of areas each having said openings being defined so that said pressurized fluid is selectively ejectable from said openings in said respective areas.
1 more element
A polishing apparatus for polishing a surface of a workpiece comprising:
- a turntable having a polishing surface thereon;
- a pressurized fluid source;
- a top ring connected with said pressurized fluid source and having upper side and a lower side for facing and applying pressure to a workpiece to be polished;
- fluid openings on said lower side of said top ring body provided in a plurality of areas on said lower side and connected with said pressurized fluid source so as to be capable of selectively and independently providing a fluid pressure to said plurality of areas on said lower side.
1 more element
The polishing apparatus for polishing a surface of a workpiece comprising:
- a turntable having a polishing surface thereon;
- a top ring for supporting the workpiece to be polished and pressing the workpiece against said polishing surface, said top ring comprising:
- a holding surface for holding the workpiece;
- a plurality of openings provided in said holding surface;
- and
- a plurality of chambers connected to a pressurized fluid source, each of said chambers is communicated with at least one of said openings so that said holding surface is divided to a plurality of areas, each of which related to each of said chambers respectively.
3 more elements
A workpiece supporting and pressing apparatus comprising:
- a holding surface made of an elastic material for holding a workpiece to be polished;
- a circular chamber positioned above a central area of said holding surface;
- a first annular chamber positioned above an annular area surrounding said central area of said holding surface;
- and
- a plurality of openings provided in said holding surface and communicated with each of said circular chamber and said first annular chamber respectively;
- wherein each pressure of said circular chamber and said first annular chamber is independently controllable.
3 more elements
A workpiece supporting and pressing apparatus comprising:
- a holding surface made of an elastic material for holding a workpiece to be polished;
- a first chamber positioned above said holding surface;
- a second chamber positioned above said holding surface;
- a first group of openings provided in said holding surface and communicated with said first chamber;
- and
- a second group of openings provided in said holding surface and communicated with said second chamber.
3 more elements
Dependencies are inferred from the claim text.