Surface acoustic wave device and production process thereof
AssigneeFujitsu Limited
InventorsYoshio Satoh, Osamu Ikata, Hidema Uchishiba, Takashi Matsuda, Tokihiro Nishihara, Mitsuo Takamatsu, Hajime Taniguchi
Life of this patent
Estimating the term…
Abstract
This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials in kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.
Claims37
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- and
- an electrode formed on said substrate by alternately laminating of an aluminum copper alloy film and a copper film such that said electrode has a three-layered laminate structure with two with CuAl2 formed at an interface between said aluminum-copper alloy films sandwiching one film and said copper film.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- and
- an electrode formed on said substrate, the electrode having aluminum-copper alloy films and a CuAl2 layer formed between the aluminum-copper alloy films, wherein
- the electrode is produced by a process of laminating aluminum-copper alloy films and a copper film, and
- said CuAl2 layer is formed from aluminum of the aluminum-copper alloy films and from copper of the copper film.
A surface acoustic wave filter comprising:
- a piezoelectric substrate;
- an input terminal;
- an output terminal;
- a series resonator connected to said input terminal and said output terminal;
- and
- a parallel resonator connected between said series resonator and a ground, said series and said parallel resonators including an electrode formed on said substrate of an aluminum copper alloy film and a copper film with CuAl2 formed at an interface between said aluminum copper alloy film and said copper film.
A surface acoustic wave filter comprising:
- a piezoelectric substrate;
- an input terminal;
- an output terminal;
- a series resonator connected to said input terminal and said output terminal;
- and
- a parallel resonator connected between said series resonator and a ground, said series and said parallel resonators including an electrode formed on said substrate, the electrode having aluminum-copper alloy films and a CuAl2 layer formed between the aluminum-copper alloy films, wherein
- the electrode is produced by a process of alternately laminating aluminum-copper alloy films and a copper film, and
- said CuAl2 layer is formed from aluminum of the aluminum-copper alloy films and from copper of the copper film.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- and
- an electrode formed on said substrate by a process comprising the steps of:
- laminating an aluminum-copper alloy film and a copper film thereby forming a laminated structure;
- and
- heating the laminated structure.
A surface acoustic wave filter comprising:
- a piezoelectric substrate;
- an input terminal;
- an output terminal;
- a series resonator connected to said input terminal and said output terminal;
- and
- a parallel resonator connected between said series resonator and a ground, said series and said parallel resonators including an electrode having an aluminum-copper alloy film and a CuAl2 layer, the electrode being formed on said substrate by a process comprising the steps of:
- laminating the aluminum-copper alloy film and a copper film thereby forming a laminated structure;
- and
- heating the laminated structure.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- and
- an electrode formed on said substrate by a process comprising the steps of:
- laminating an aluminum-copper alloy film and a copper film thereby forming a laminated structure with the aluminum-copper alloy film facing said substrate;
- and
- heating the laminated structure.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- and
- an electrode formed on said substrate by a process comprising the steps of:
- alternately laminating aluminum-copper alloy films and a copper film thereby forming a laminated structure;
- and
- heating the laminated structure.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- and
- an electrode formed on said substrate by a process comprising the steps of:
- alternately laminating aluminum-copper alloy films and a copper film thereby forming a laminated structure with one of the aluminum-copper alloy films facing said substrate;
- and
- heating the laminated structure.
Dependencies are inferred from the claim text.