A method of cleaning a vacuum processing chamber between workpiece processing operations wherein the workpiece processing is performed by supplying processing gas to the chamber via a first port while the chamber is in vacuo, the processing gas having a tendency to leave a clogging residue in the first port, the chamber including a second port separate from the first port, the method comprising applying r.f. plasma excitation power to a structure including the first port while introducing a cleaning gas into the chamber via the second port while the chamber remains in vacuo and the processing gas is not supplied to the chamber so pressure is equalized at the first port and the cleaning gas cleans the first port of the clogging residue as well as the remainder of the chamber. , the cleaning gas being converted to a plasma by r.f. plasma excitation power applied to it via the structure.